Aluminum nitride ceramics have been widely used in many civil and military fields due to their excellent performance in many aspects. The advent of the 5G/new energy vehicles/artificial intelligence has increased the demand for aluminum nitride ceramics.
| Category | Application | Specific typical applications |
| Civil | Integrated circuits, Automobiles, High-speed rail, Electricity, Semiconductors | High-power device heat dissipation substrates, electrostatic chucks for wafer processing, semiconductor equipment structural parts |
| Military | Aerospace, national defense weapons, microwave radar | Ship navigation systems, missile positioning systems, ground radar systems |
AlN is widely used. Due to its excellent thermal conductivity, it has become an ideal material for the packaging of new-generation transistors and electronic devices. It is used in transistors, crucibles, protection tubes, casting molds, piezoelectric ceramics and thin films, simulation, etc.
- Heat dissipation substrate and electronic device packaging
Heat dissipation substrates and electronic device packaging are the main application areas of AlN ceramics. Aluminum nitride ceramics have excellent thermal conductivity, thermal expansion coefficient close to silicon, high mechanical strength, good chemical stability, environmental protection, and non-toxicity. They are considered to be the ideal material for the new generation of heat dissipation substrates and electronic device packaging. They are very suitable for the packaging of hybrid power switches and the packaging shell material of microwave vacuum tubes. The application of aluminum nitride ceramic substrates is also an ideal material for large-scale integrated circuit substrates.
2. Structural ceramics
Electrostatic chucks for wafer processing are common structural ceramic applications. Aluminum nitride structural ceramics have good mechanical properties, high hardness, and better toughness than Al2O3 ceramics, and are resistant to high temperatures and corrosion. Using the heat resistance and corrosion resistance of AIN ceramics, it can be used to make high-temperature corrosion-resistant parts such as crucibles, Al evaporating dishes, and semiconductor electrostatic chucks.
3. Functional materials
Aluminum nitride can be used to manufacture high-frequency and high-power devices that can be used in high-temperature or radiation scenarios, such as high-power electronic devices, high-density solid-state memory, etc. Aluminum nitride, one of the third-generation semiconductor materials, has excellent properties such as wide bandgap, high thermal conductivity, high resistivity, good ultraviolet transmittance, and high breakdown field strength. The bandgap of AlN is 6.2 eV, and the polarization effect is strong. It has applications in mechanics, microelectronics, optics, surface acoustic wave device (SAW) manufacturing, high-frequency broadband communications, and other fields, such as aluminum nitride piezoelectric ceramics and thin films. In addition, high-purity AlN ceramics are transparent and have excellent optical properties. Combined with their electrical properties, they can be used to make infrared deflectors, sensors and other functional devices.
4. Inert heat-resistant materials
AlN can be used as a heat-resistant material as a crucible, protective tube, casting mold, etc. Aluminum nitride can still have stable performance in a non-oxidizing atmosphere at 2000℃. It is an excellent high-temperature refractory material with strong resistance to molten metal corrosion.
5. Heat exchange devices
Aluminum nitride ceramics have high thermal conductivity, low thermal expansion coefficient, excellent thermal conductivity efficiency, and thermal shock resistance, and can be used as ideal thermal shock and heat exchange materials. For example, aluminum nitride ceramics can be used as heat exchanger materials for marine gas turbines and heat-resistant components for internal combustion engines. Due to the excellent thermal conductivity of aluminum nitride materials, the heat transfer capacity of heat exchangers is effectively improved.
6. Filling materials
Aluminum nitride has excellent electrical insulation, high thermal conductivity, good dielectric properties, and good compatibility with polymer materials. It is an excellent additive for polymer materials of electronic products. It can be used for TIM fillers and FCCL thermal conductive dielectric layer fillers. It is widely used in heat transfer media of electronic devices to improve work efficiency, such as gap filling between CPU and radiator, and heat transfer media in the fine gaps where high-power triodes and thyristor components contact the substrate.
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