With the rapid development of semiconductor lighting today, the key problem of LED – heat dissipation will become a big problem. As a modern environmentally friendly and energy-saving light source, LED has been developed since the 1960s. As a fairly mature industry, small enterprises want to develop, medium-sized enterprises want to break through, and large enterprises want more market share. Major manufacturers are taking the road of differentiation. Only innovation can save LED. The biggest problem restricting LED research and development is still heat dissipation. If this fatal problem is not solved, there is no way to carry out new research and development of LED. The birth of aluminum nitride ceramic substrates is undoubtedly a shot in the arm of the LED industry.
The most widely used position of aluminum nitride ceramic substrates in LED is automotive LED headlights. In the automotive industry, there are quite a lot of laws and regulations, and high-quality ceramic substrates must be used to meet the needs. However, with the increase in people’s demand for lighting, ordinary LEDs can no longer satisfy people. People need cooler LED lights, and behind the coolness is the increase in cost. Aluminum nitride ceramic substrates are the best choice, which can effectively ensure the heat dissipation of LEDs. After the heat dissipation problem can be solved, the coolness of LEDs will not be a problem. The light source of the aluminum nitride ceramic substrate is better than the metal bracket in terms of color drift caused by the change of phosphor properties due to high temperature and lumen efficiency attenuation. The reason is that the thermal mismatch between the metal bracket and the chip is significantly higher than the thermal mismatch between the ceramic material and the chip, resulting in excessive thermal stress between the chip and the metal bracket at high temperatures. In other words, the thermal expansion coefficient of aluminum nitride ceramic substrate is much smaller than that of metal substrate, and the thermal expansion coefficient of silicon chip is generally very small. Large thermal stress will affect the luminous efficiency of the chip itself, and may even cause the chip to loosen from the substrate, resulting in poor heat dissipation of some chips, resulting in serious light decay or even dead light. With the continuous increase in the power of LED light sources and the increasing degree of integration of packaging, aluminum nitride ceramic substrates can effectively reduce the junction temperature of LEDs, increase the life of LED light sources, improve the stability of LED light sources, and significantly improve the reliability of high-power LED light sources, indicating that aluminum nitride ceramic substrates will have a wide range of application value and market prospects in the LED industry.
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